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| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | EVO |
| Pricing | Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | MultiSEM |
| Electron Beam Configuration | Hexagonal array of 91 beams |
| Landing Energy Range | 1.0–3.0 kV |
| Average Resolution (all beams) | ≤ 3.5 nm @ 1.0 / 1.5 / 3.0 kV |
| Resolution Uniformity | ≤ ±1 nm @ 1.0 / 1.5 / 3.0 kV and 12 µm pitch |
| Beam Pitch Options | 12 µm (standard), 15 µm (optional) |
| Pitch Uniformity | ≤ ±1% |
| Field of View (hexagonal long axis) | 132 µm (12 µm pitch) or 165 µm (15 µm pitch) |
| Per-Beam Current | ≥ 570 pA |
| Total Probe Current | ≥ 52 nA |
| Current Uniformity | ≤ +10% |
| Electron Source | Schottky field-emission gun |
| Filament Current Stability | ≤ 1% per hour |
| Beam Blanking | Electrostatic |
| Working Distance | 1.4 mm |
| Detector System | High-efficiency multi-channel secondary electron detection with projection optics |
| Maximum Scan Rate per Beam | 20 MHz |
| Pixel Size Range | 2–20 nm (12 µm pitch) |
| Image Stitching | Fully automated, 91-subimage hexagonal tiling with adjustable overlap |
| Stage Type | Precision stepper stage |
| Stage Travel (X/Y/Z) | 100 / 100 / 30 mm |
| Stage Repeatability (XY) | ≤ ±3 µm |
| Sample Exchange Time (with exchange chamber) | ≤ 5 min |
| Sample Dimensions (max) | 100 × 100 mm² (XY), ≤ 30 mm height, ≤ 0.2 kg mass, surface flatness ≤ 500 nm P–P over 100 µm |
| Vacuum System | Turbo-molecular pump (>260 L/s) + oil-free scroll pump |
| Control Hardware | ≥4-core 64-bit CPU, ≥32 GB DDR RAM, ≥1 TB HDD, dual 1 Gbit Ethernet |
| OS | Windows 10 (64-bit) |
| Image Acquisition Nodes | 12 rack-mounted computers (≥4-core 64-bit CPU, ≥32 GB DDR3, 1 Gbit + 10 Gbit Ethernet) |
| Software Platform | ZEN core interface with Shuttle & Find, API for custom workflow integration, distributed acquisition database, automated focus/astigmatism/detector balancing, ROI-driven auto-sectioning, continuous serial sectioning workflows, real-time system health monitoring (vacuum, alignment, beam stability) |
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